# TDK to acquire Chirp Microsystems for ultrasonic 3D sensing

TDK has signed an agreement to acquire Chirp Microsystems, a pioneer in high-performance ultrasonic 3D sensors, to expand its sensor business. The acquisition will combine Chirp's technology with TDK's fingerprint, MEMS, and piezo-ceramic sensors.

- Type: Acquisition
- Announced: 2021-02-12
- Where: Berkeley, California, United States
- Status: announced
- Products: ultrasonic 3D sensors, fingerprint sensors, MEMS sensors, piezo-ceramic sensors
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md), [Automotive Components](https://endata.com/sectors/automotive-components.md)

## Companies

- [TDK Corporation](https://endata.com/companies/15441.md) (acquirer)
- [Chirp Microsystems](https://endata.com/companies/30371.md) (target)

## Sources

- [tdk.com](https://www.tdk.com/ja/news_center/press/20180228_01.html), 2021-02-12: "TDKは高性能超音波3Dセンシングを手掛けるChirp Microsystems, Incの買収契約を締結"

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Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.