# ASM Pacific Technology and EV Group partner on die-to-wafer hybrid bonding

ASM Pacific Technology and EV Group signed a joint development agreement on 29 January 2021 to co-develop die-to-wafer hybrid bonding solutions for 3D-IC/heterogeneous integration applications.

- Type: Partnership
- Announced: 2021-01-29
- Status: announced
- Products: die-to-wafer hybrid bonding solutions
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [ASM Pacific Technology](https://endata.com/companies/18453.md) (partner)
- [EV Group](https://endata.com/companies/40194.md) (partner)

## Sources

- [evgroup.com](https://www.evgroup.com/company/news/detail/asm-pacific-technology-and-ev-group-join-forces-to-enable-industrys-first-ultra-precision-die-to-wafer-hybrid-bonding-solutions-for-3d-ic-heterogeneous-integration), 2021-01-29: "Die-to-wafer hybrid bonding is a pivotal process for enabling the redesign of system-on-chip (SoC) devices to 3D stacked chips via chiplet technology"

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Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.