# Qingdao HKC six-inch semiconductor project tops out in Jimo

The main structure of Qingdao HKC's six-inch wafer semiconductor power device project in Jimo, Qingdao, has been topped out. The project, with a total investment of 2.9 billion yuan, is expected to be put into production by the end of 2020, with an annual production scale of 2.4 million chips and 1 million advanced encapsulated chips.

- Type: New facility
- Announced: 2021-01-21
- Where: Jimo, Qingdao, China
- Value: $448.0M (2.90B CNY)
- Starts operating: 2020
- Status: under construction
- Capacity: 2.4 million chips and 1 million advanced encapsulated chips per year
- Products: six-inch wafer semiconductor power devices, chips
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [HKC (Huike Group)](https://endata.com/companies/52694.md)

## Sources

- [en.qdhkc.com.cn](http://en.qdhkc.com.cn/444/shownews.php?id=200&lang=qdhuikeen), 2021-01-21: "The project will be put into production at the end of 2020, after which it is expected to reach an annual production scale of 2.4 million chips and 1 million advanced encapsulated chips."

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Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.