# Tongfu Microelectronics starts third-phase chip packaging project in Nantong

Tongfu Microelectronics (通富微电) began construction of its third-phase intelligent chip packaging and testing project in Nantong, China. The project will add production capacity of 1.5 billion IC products and 100,000 wafers per year.

- Type: Expansion
- Announced: 2021-01-15
- Where: Nantong, Jiangsu, China
- Status: under construction
- Capacity: 1.5 billion IC products and 100,000 wafers per year
- Products: integrated circuits, wafer-level packaging
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [Tongfu Microelectronics Co., Ltd.](https://endata.com/companies/22832.md)

## Sources

- [sohu.com](https://www.sohu.com/a/444769219_166680), 2021-01-15: "通富微电三期智能芯片封测项目总建筑面积达9.54万平米，项目达成后，将形成不低于年产集成电路产品15亿片、晶圆级封装10万片的生产能力。"

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Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.