# 立昂微 to build $43M microwave RF chip plant in Haining, China

Hangzhou Li'ang Microelectronics (立昂微) announced a 4.3 billion yuan investment to build a 6-inch GaAs/GaN microwave RF IC plant in Haining, Zhejiang, with annual capacity of 360,000 wafers. The project will be implemented in phases over five years via a new subsidiary, Haining Li'ang Dongxin Microelectronics.

- Type: New facility
- Announced: 2021-01-05
- Where: Haining, Zhejiang, China
- Value: $665.0M (4.30B CNY)
- Status: announced
- Capacity: 360,000 6-inch wafers per year
- Products: GaAs/GaN microwave RF ICs, VCSEL chips
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [Hangzhou Li'ang Microelectronics Co., Ltd.](https://endata.com/companies/32327.md)

## Sources

- [casmita.com](https://www.casmita.com/news/202101/05/2985.html), 2021-01-05: "该项目建成后预计年产 36 万片 6 英寸砷化镓/氮化镓微波射频集成电路芯片。"

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Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.