# Wingtech starts construction of 12-inch automotive power semiconductor wafer plant in Shanghai

Wingtech Technology began construction of a 12-inch automotive-grade power semiconductor wafer manufacturing project in the Lingang Special Area of Shanghai. The project involves a total investment of CNY 12 billion and is expected to produce 400,000 wafers annually.

- Type: New facility
- Announced: 2021-01-04
- Where: Lingang Special Area, Shanghai, China
- Value: $1.85B (12.0B CNY)
- Status: under construction
- Capacity: 400,000 wafers per year
- Products: 12-inch automotive power semiconductor wafers, power devices
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [Wingtech Technology](https://endata.com/companies/35119.md)

## Sources

- [chinanews.com.cn](https://www.chinanews.com.cn/cj/2021/01-04/9378231.shtml), 2021-01-04: "闻泰科技'12英寸车规级功率半导体晶圆制造项目'4日在中国(上海)自由贸易试验区临港新片区开工。"

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Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.