# Samsung Electronics plans capacity expansion for memory chips in 2021

Samsung Electronics plans to expand monthly wafer capacity for DRAMs by 30,000, flash memory by 60,000, and foundry chips by 20,000 in 2021, with investments of at least 10 trillion won into its Pyeongtaek and Austin plants.

- Type: Expansion
- Announced: 2020-11-23
- Where: Pyeongtaek, Gyeonggi Province, South Korea
- Value: $9.00B (10000.0B KRW)
- Starts operating: 2021
- Status: announced
- Capacity: 30,000 wafers per month for DRAMs, 60,000 for flash memory, 20,000 for foundry chips
- Products: DRAMs, NAND flash memory, foundry chips
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [Samsung Electronics](https://endata.com/companies/647.md)

## Sources

- [koreatimes.co.kr](https://www.koreatimes.co.kr/business/tech-science/20201123/samsung-set-to-splurge-on-memory-chips), 2020-11-23: "Samsung plans to expand its monthly wafer capacity for DRAMs, flash memory and foundry chips by 30,000, 60,000 and 20,000, respectively, next year."
- [businesskorea.co.kr](https://www.businesskorea.co.kr/news/articleView.html?idxno=56553), 2020-12-10: "Orders for CISs of more than 108 million pixels are currently increasing, but production is limited. One DRAM fab will be changed to a CIS line next year."

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Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.