# Daeduck Electronics expands FC-BGA production for non-memory semiconductors

Daeduck Electronics has expanded mass production of flip-chip ball grid array (FC-BGA) substrates for non-memory semiconductors since October 2020. The company plans to build a new FC-BGA plant in Ansan, South Korea, with a 90 billion won investment, starting operations in the second half of 2021.

- Type: Expansion
- Announced: 2020-11-04
- Where: Siheung, Ansan, South Korea
- Value: $81.0M (90.0B KRW)
- Starts operating: Q3 2021
- Status: under construction
- Capacity: 9000 billion won production capacity in semiconductor package by 2022
- Products: FC-BGA substrates
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [Daeduck Electronics](https://endata.com/companies/34942.md)

## Sources

- [thelec.kr](https://www.thelec.kr/news/articleView.html?idxno=8672), 2020-11-04: "FC-BGA 신 공장은 내년 하반기 본격 가동 예정입니다."

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Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.