# CAPLINQ signs distribution agreement with Hysol for epoxy molding compounds

CAPLINQ Europe BV has signed a definitive agreement to become Hysol Huawei Electronics' European and American Market Partner, promoting, selling, distributing, and supporting Hysol's semiconductor-grade epoxy molding compounds in Europe, the Americas, Middle East and Asia.

- Type: Contract
- Announced: 2020-10-05
- Status: completed
- Products: semiconductor-grade epoxy molding compounds
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [CAPLINQ Europe](https://endata.com/companies/42676.md)
- [Hysol Huawei Electronics](https://endata.com/companies/50353.md) (customer)

## Sources

- [blog.krayden.com](https://blog.krayden.com/caplinq-signs-distribution-agreement-with-hysol-in-europe-and-the-americas_3464/), 2020-10-05: "CAPLINQ Europe BV announced today that it has become Hysol Huawei Electronics' 'European and American Market Partner' to promote, sell, distribute, and support its products in Europe, the Americas, Middle East and Asia (EMEA)."

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Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.