# Yiwei Technology and Visino sign 25.4 billion yuan investment projects in Chengdu

Beijing Yiwei Technology and Visino Technology signed contracts with Chengdu High-tech Zone for projects totaling 25.4 billion yuan. Yiwei's project is a 11 billion yuan high-end board-level packaging system integrated circuit project; Visino's project is a Micro-LED advanced display technology R&D and industrialization verification project.

- Type: Investment
- Announced: 2020-08-26
- Where: Chengdu, Sichuan, China
- Value: $3.70B (25.4B CNY)
- Status: announced
- Products: high-end board-level packaging system integrated circuits, Micro-LED advanced display
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [Beijing Yiwei Technology](https://endata.com/companies/49569.md) (investor)
- [Visino Technology](https://endata.com/companies/49570.md) (investor)

## Sources

- [news.metal.com](https://news.metal.com/newscontent/101251923-yi-siwei-visino-and-other-core-projects-signed-a-contract-to-settle-in-chengdu-on-the-same-day), 2020-08-28: "A number of enterprises, such as Beijing Yiwei Technology Co., Ltd., Vishino Technology Co., Ltd., have signed contracts with Chengdu High-tech Zone."

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Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.