# ASE breaks ground on K13 IC packaging and testing plant in Kaohsiung

Advanced Semiconductor Engineering (ASE) held a groundbreaking ceremony for its K13 plant in Kaohsiung. The plant will have 2 underground and 12 above-ground floors, total area over 32,000 sq m, and is expected to create 2,800 jobs. Construction investment is NTD 8 billion, with an additional NTD 18 billion for advanced packaging capacity. Completion expected in 2023.

- Type: New facility
- Announced: 2020-08-17
- Where: Kaohsiung, Taiwan, TWN
- Value: $270.0M (8.00B TWD)
- Jobs: 2,800
- Starts operating: 2023
- Status: under construction
- Products: IC packaging and testing services
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [Advanced Semiconductor Engineering](https://endata.com/companies/19708.md)

## Sources

- [semimedia.cc](https://www.semimedia.cc/ases-k13-ic-packaging-testing-plant-breaks-ground/), 2020-08-17: "ASE stated that the K13 plant will take high-end packaging technology as the core."
- [evertiq.com](https://evertiq.com/design/48682), 2020-08-19: "Advanced Semiconductor Engineering (ASE) has officially broken ground for its new advanced packaging fab at the Nantze Export Processing Zone in Kaohsiung, Taiwan."

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Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.