# Shanghai Woodson to build $3B semiconductor fab in Nanjing

Shanghai Woodson Electronics Technology Group, with China Semiconductor and Shin Kong Global Venture Capital, will build a semiconductor project in Nanjing, China, including a fab, packaging/test facility, and IC design center. Total investment is $3 billion.

- Type: New facility
- Announced: 2020-07-27
- Where: Nanjing, Jiangsu, China
- Value: $3.00B
- Starts operating: Apr 2021
- Status: announced
- Capacity: 40000 12-inch wafers per month
- Products: OLED driver IC
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [Shanghai Woodson Electronics Technology Group](https://endata.com/companies/48919.md)
- [China Semiconductor Co., Ltd.](https://endata.com/companies/47734.md) (investor)
- [Shin Kong Global Venture Capital Corp](https://endata.com/companies/48920.md) (investor)

## Sources

- [english.jschina.com.cn](https://english.jschina.com.cn/23262/202007/t20200728_6746921.shtml), 2020-07-28: "Construction of the first phase will start from October this year and is expected to be put into production in April next year, with a monthly output of 40,000 12-inch wafers."

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Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.