# Foxconn starts building $8.6 billion semiconductor fab in Qingdao, China

Foxconn began construction on an advanced semiconductor assembly and test plant in Qingdao, China, with an investment of $8.6 billion, expected to produce solutions for 5G and AI devices.

- Type: New facility
- Announced: 2020-07-22
- Where: Qingdao, China
- Value: $8.60B
- Starts operating: 2021
- Status: under construction
- Capacity: 30,000 12-inch wafers per month
- Products: advanced semiconductor assembly and test, 5G and AI solutions
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [Foxconn](https://endata.com/companies/15170.md)
- [Rongkong Group](https://endata.com/companies/46688.md) (investor)

## Sources

- [kitguru.net](https://www.kitguru.net/channel/generaltech/christopher-nohall/foxconn-starts-building-new-8-6-billion-fab-in-china/), 2020-07-22: "Foxconn has reportedly begun construction on a new advanced semiconductor assembly and test plant this week."
- [emsnow.com](https://www.emsnow.com/foxconn-breaks-ground-for-new-chip-plant-in-china/), 2020-07-27: "Foxconn plans to invest a total of CNY60 billion (US$8.6 billion) in the new plant project, according to sources familiar with the matter."

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Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.