# SMIC to build $7.6B chip plant in Beijing

Semiconductor Manufacturing International Corp. (SMIC) plans to invest $7.6 billion to build a new integrated circuit production base at the Beijing Economic Technological Development Area. The joint venture will focus on 28nm and above mature processes, with first-phase capacity of 100,000 12-inch wafers per month.

- Type: New facility
- Announced: 2020-07-31
- Where: Beijing Economic Technological Development Area, Yizhuang, China
- Value: $7.60B
- Status: announced
- Capacity: 100,000 12-inch wafers per month (first phase)
- Products: integrated circuits (28nm and above)
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [Semiconductor Manufacturing International Corporation](https://endata.com/companies/19550.md)

## Sources

- [www2.yicaiglobal.com](https://www2.yicaiglobal.com/news/chinese-chipmaker-smic-to-build-usd76-billion-beijing-plant), 2020-08-04: "The project will help boost production capacity to meet growing demand, improve SMIC's positioning in the international market and promote Beijing's integrated circuit industry."

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Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.