# Soitec signs POI substrate supply agreement with Qualcomm Technologies

Soitec signed an agreement with Qualcomm Technologies to supply piezoelectric-on-insulator (POI) engineered substrates for 4G and 5G RF filters, moving to high volume manufacturing.

- Type: Contract
- Announced: 2020-07-13
- Status: announced
- Products: POI engineered substrates, RF filters
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [Qualcomm Technologies](https://endata.com/companies/23202.md) (customer)
- [SOITEC](https://endata.com/companies/32773.md) (supplier)

## Sources

- [newelectronics.co.uk](https://www.newelectronics.co.uk/content/news/soitec-signs-poi-agreement-with-qualcomm-technologies), 2020-07-13: "This agreement with Soitec is key to ensure the supply of high-performance POI substrates, and to securely support the demand from our OEM customers for high-performance Qualcomm ultraSAW RF filter products."

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Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.