# Kexin Electronics invests 600 million yuan in semiconductor R&D and production base in Hangzhou

Kexin Electronics signed a project to build a semiconductor R&D and production base in Hangzhou's Economic Development Zone, with a total investment of 600 million yuan. The facility will produce 6-inch GPP chips, 6-inch epitaxial wafers, and TVS chips.

- Type: New facility
- Announced: 2020-06-29
- Where: Hangzhou Economic Development Zone, China
- Value: $85.0M (600.0M CNY)
- Status: announced
- Products: 6-inch GPP chips, 6-inch epitaxial wafers, TVS chips
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [Kexin Electronics](https://endata.com/companies/48344.md)

## Sources

- [sensor360.org](https://www.sensor360.org/news/detail/11822), 2020-07-03: "Electronics Semiconductor R&D and Production Base Construction Project, with a total investment of 600 million yuan, will independently develop 6-inch GPP chips, 6-inch epitaxial wafers, TVS chips and other products."

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Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.