# Danfoss signs multi-year volume agreement with Infineon for power semiconductors

Danfoss has signed a multi-year volume agreement with Infineon for IGBT and diode chipsets, to be used in power modules for electric vehicle inverters. Chips will be supplied from Infineon's Villach and Dresden plants.

- Type: Contract
- Announced: 2020-06-17
- Where: Germany
- Status: completed
- Products: IGBTs, diodes, power modules for EV inverters
- Sectors: [Automotive Components](https://endata.com/sectors/automotive-components.md), [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [Danfoss](https://endata.com/companies/1945.md) (customer)
- [Infineon](https://endata.com/companies/22833.md) (supplier)

## Sources

- [elektroniknet.de](https://www.elektroniknet.de/automotive/elektromobilitaet/danfoss-schliesst-mehrjaehrigen-volumenvertrag-mit-infineon.b1b6d2cc-67b0-4a51-86ff-669b2e01ec49.html), 2020-06-17: "Für den steigenden Marktbedarf an Leistungshalbleitern für Elektroautos hat Danfoss einen mehrjährigen Volumenvertrag mit Infineon geschlossen."

---
Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.