# Jiangsu Renqi to build chip industrial park in Siyang, Jiangsu

Jiangsu Renqi Technology plans to build a chip industrial park in Siyang Economic Development Zone, with annual capacity of 600,000 6-inch wafers and 1 billion chip packages/tests. The EPC contract with 11th Design & Research Institute is valued at CNY 1.0886 billion.

- Type: New facility
- Announced: 2020-06-17
- Where: Siyang, Jiangsu, China
- Value: $154.0M (1.09B CNY)
- Status: announced
- Capacity: 600,000 6-inch wafers per year; 1 billion chip packages/tests per year
- Products: compound semiconductor wafers (GaAs), integrated circuits
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [Jiangsu Renqi Technology](https://endata.com/companies/47927.md)
- [11th Design & Research Institute](https://endata.com/companies/47928.md) (partner)

## Sources

- [casmita.com](https://www.casmita.com/news/202006/17/836.html), 2020-06-17: "江苏仁奇科技有限公司芯片产业园区投资建设项目拟利用2年时间，在泗阳经济开发区建成一个涵盖芯片制造、封测、研发的产业化基地，形成年产6英寸0.25um芯片线60万片，年封测10亿颗的生产能力。"

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Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.