# Western Semiconductor IC High-Tech Industrial Park breaks ground in Mianyang

A groundbreaking ceremony was held for the Western Semiconductor Integrated Circuit High-Tech Industrial Park project in Mianyang, Sichuan, with a total investment of 8.026 billion yuan. The project will build an 8-inch wafer fab with an annual capacity of 600,000 pieces.

- Type: New facility
- Announced: 2020-05-30
- Where: Mianyang, Sichuan, China
- Value: $1.13B (8.03B CNY)
- Status: under construction
- Capacity: 600,000 8-inch wafers per year
- Products: integrated circuits, 8-inch wafers
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [Western Semiconductor Integrated Circuit High-Tech Industrial Park](https://endata.com/companies/47564.md)

## Sources

- [mianyang.scol.com.cn](https://mianyang.scol.com.cn/sdtp/202005/57818055.html), 2020-05-31: "总投资80.26亿元的西部半导体集成电路高科技产业园项目开工仪式在绵阳游仙高新区(南区)五里梁举行。"

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Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.