# BRIDG awarded $28M contract by Radiance Technologies

BRIDG has been awarded a three-year contract by Radiance Technologies with a ceiling of $28 million to develop advanced semiconductor packaging technologies, leveraging BRIDG's 200mm microelectronics fabrication facility in NeoCity, Florida.

- Type: Contract
- Announced: 2020-05-21
- Where: NeoCity, Kissimmee, Florida, United States
- Value: $28.0M
- Status: completed
- Products: advanced semiconductor packaging, microelectronics
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [BRIDG](https://endata.com/companies/43812.md)
- [Radiance Technologies](https://endata.com/companies/47409.md) (customer)

## Sources

- [gobridg.com](https://gobridg.com/bridg-awarded-28m-advanced-semiconductor-packaging-contract-by-radiance-technologies/), 2020-05-21: "BRIDG announced today that it has been awarded a contract by Radiance Technologies, Inc. (Radiance) to develop advanced semiconductor packaging technologies"

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Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.