# Qorvo awarded DoD contract to advance copper-pillar-on-GaN technology

Qorvo was awarded a three-year contract by the Department of Defense to advance copper-pillar-on-GaN flip-chip technology for phased array radar and defense electronics, aiming for Manufacturing Readiness Level 9 by 2022.

- Type: Contract
- Announced: 2020-05-20
- Where: United States
- Status: completed
- Products: copper-pillar-on-GaN flip-chip technology
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [Qorvo](https://endata.com/companies/20471.md)
- [U.S. Department of Defense](https://endata.com/companies/4836.md) (customer)
- [Naval Surface Warfare Center, Crane Division](https://endata.com/companies/38044.md) (customer)

## Sources

- [qorvo.com](https://www.qorvo.com/about/news-events/news-releases/2020/qorvo-awarded-dod-contract-to-advance-copper-pillar-on-gan-technology), 2020-05-20: "This contract leverages Qorvo's 30-year investment in GaN and GaAs manufacturing and packaging technology."
- [spotonnorthcarolina.com](https://spotonnorthcarolina.com/nc-business/1126860/greensboros-qorvo-lands-contract.html), 2020-05-26: "Greensboro-based semiconductor company Qorvo landed a three-year contract with the U.S. Department of Defense."

---
Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.