# BYD Semiconductor breaks ground on $140M wafer fab in Changsha

BYD Semiconductor has broken ground on a 200mm wafer fab in Changsha, Hunan, China. The total investment is about $140 million, and annual revenue is expected to reach $113 million after production starts.

- Type: New facility
- Announced: 2020-04-28
- Where: Changsha, Hunan, China
- Value: $140.0M
- Status: under construction
- Capacity: 250,000 8-inch wafers per year
- Products: power semiconductors, control ICs, smart sensors, optoelectronic semiconductors, IGBT modules
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [BYD Semiconductor](https://endata.com/companies/46903.md)

## Sources

- [semimedia.cc](https://www.semimedia.cc/byd-announces-groundbreaking-of-its-semiconductor-200mm-fab/), 2020-04-30: "BYD Semiconductor announced that its wafer fab in Changsha City, Hunan Province, China has broken ground."
- [tech.sina.cn](https://tech.sina.cn/2020-04-30/detail-iirczymi9176567.d.html?vt=4), 2020-04-30: "计划总投资10亿的长沙比亚迪半导体八英寸晶圆生产线项目在列。"

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Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.