# IBIDEN invests 60 billion yen to increase IC package substrate capacity

IBIDEN announced a 60 billion yen investment to increase IC package substrate production capacity at its Ogaki Central Plant. Operations will start sequentially from end of 2020, with mass production beginning in FY21.

- Type: Investment
- Announced: 2020-04-27
- Where: Ogaki, Japan
- Value: $560.0M (60.0B JPY)
- Starts operating: 2021
- Status: announced
- Products: IC package substrates
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [IBIDEN Co., Ltd.](https://endata.com/companies/23859.md)

## Sources

- [seisanzai-japan.com](https://seisanzai-japan.com/article/p1828/), 2020-04-30: "IBIDEN announced on April 27, 2020 that it will increase its IC package substrate production capacity at the Ogaki Central Plant."

---
Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.