# Fuxin Semiconductor to build CNY 40B analog chip IDM project in Hangzhou

Fuxin Semiconductor's analog chip IDM project, with a total investment of CNY 40 billion, will build a 12-inch wafer fab with 65-90nm process technology, producing power management analog chips for automotive, AI, mobile, smart home and industrial applications. The project is located in the Hangzhou High-tech Zone (Binjiang) Fuyang Special Cooperation Zone.

- Type: New facility
- Announced: 2020-03-20
- Where: Hangzhou High-tech Zone (Binjiang) Fuyang Special Cooperation Zone, Zhejiang, China
- Value: $5.60B (40.0B CNY)
- Status: announced
- Capacity: 50,000 wafers per month
- Products: power management analog chips, 12-inch wafers
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [Fuxin Semiconductor](https://endata.com/companies/46048.md)

## Sources

- [semiwebs.com](https://www.semiwebs.com/6160.html), 2020-03-20: "富芯半导体模拟芯片IDM项目总投资400亿元、用地647亩，拟建设12英寸、加工精度65-90nm集成电路芯片生产线"

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Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.