# CanSemi to expand second-phase fab in Guangzhou with CNY 6.5B investment

CanSemi signed an agreement on February 28, 2020 to expand its second-phase 300mm wafer fab in Guangzhou, China, with a CNY 6.5 billion capital increase to build a 65-90nm analog process platform for chips including high-precision analog converters, power management ICs, optical sensors, and automotive and biosensors.

- Type: Expansion
- Announced: 2020-02-28
- Where: Guangzhou, China, China
- Value: $930.0M (6.50B CNY)
- Starts operating: 2022
- Status: announced
- Capacity: 40,000 300mm wafers per month (combined Phase 1 and Phase 2 by 2022)
- Products: analog chips, power management chips, optical sensors, automotive sensors, biosensors
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [CanSemi](https://endata.com/companies/42731.md)

## Sources

- [kipost.net](https://www.kipost.net/news/articleView.html?idxno=203249), 2020-03-02: "캔세미의 2기 공장을 위해 65억 위안(약 1조 1천115억 원)을 증자하고 65~90nm 아날로그 공정 플랫폼을 구축하는 것이 목표다."

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Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.