# CanSemi Semiconductor signs Phase 2 expansion with $930M investment

CanSemi Semiconductor signed a Phase 2 expansion project on February 28, 2020, adding 6.5 billion yuan ($930 million) in investment. The expansion will focus on 65-90nm analog process platforms, producing high-precision ADC chips, power management chips, optical sensors, and automotive chips. Combined Phase 1 and 2 capacity is expected to reach 40,000 12-inch wafers per month by 2022.

- Type: Expansion
- Announced: 2020-02-28
- Where: Guangzhou, Guangdong, China
- Value: $930.0M (6.50B CNY)
- Starts operating: 2022
- Status: announced
- Capacity: 40,000 12-inch wafers per month (Phase 1+2)
- Products: high-precision ADC chips, power management chips, optical sensors, automotive chips, biosensor chips
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [CanSemi Semiconductor](https://endata.com/companies/45583.md)

## Sources

- [m.cls.cn](https://m.cls.cn/detail/449428), 2020-02-28: "粤芯半导体二期扩产项目成功签约，二期建设将新增投资65亿元，专注于65-90nm模拟工艺平台。"
- [compoundsemiconductorchina.net](https://www.compoundsemiconductorchina.net/industry-news.asp?id=2324), 2020-03-03: "粤芯半导体二期扩产项目成功签约，二期建设将新增投资65亿元，专注于65-90nm模拟工艺平台，生产高精度数模转换芯片、高端电源管理芯片、光学传感器、车载及生物传感芯片等产品。"

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Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.