# BAE Systems wins $8M DARPA contract for mixed-signal electronics

DARPA awarded BAE Systems an $8 million contract under the T-MUSIC programme to design and develop wafer-scale mixed-signal electronics on a silicon foundry platform.

- Type: Contract
- Announced: 2020-01-29
- Where: United States
- Value: $8.00M
- Status: announced
- Products: mixed-signal electronics, wafer-scale technology
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [BAE Systems](https://endata.com/companies/4538.md)
- [DARPA](https://endata.com/companies/34950.md) (customer)

## Sources

- [army-technology.com](https://www.army-technology.com/news/bae-systems-darpa-electronics/), 2020-01-29: "T-MUSIC will incorporate analogue and digital signals on a single chip for high-performance data converters and digital processing and intelligence."

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Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.