# PAX Global Technology renews chip procurement agreement with Hi Sun Group

PAX Global Technology Ltd renewed a framework agreement with Hi Sun Group to purchase encryption, processor, and contactless card reader chips from January 1, 2020 to December 31, 2022.

- Type: Contract
- Announced: 2019-12-30
- Status: announced
- Products: encryption chips, processor chips, contactless card reader chips
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [PAX Global Technology](https://endata.com/companies/44214.md) (customer)
- [Hi Sun Group](https://endata.com/companies/44215.md) (supplier)

## Sources

- [beta.zhitongcaijing.com](http://beta.zhitongcaijing.com/content/detail/263216.html), 2019-12-30: "The parties entered into a 2020 framework agreement on December 30, 2019, under which the Group will continue to purchase chips from Hi Sun Group."

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Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.