# Guangxi Tianwei chip project officially settles in Hezhou

The Guangxi Tianwei chip project, with a total investment of 500 million RMB, has officially settled in Hezhou. Phase 1 invested 100 million RMB and is expected to start production by the end of December 2019.

- Type: New facility
- Announced: 2019-12-18
- Where: Hezhou, Guangxi, China
- Value: $71.4M (500.0M CNY)
- Jobs: 500
- Starts operating: Dec 2019
- Status: under construction
- Products: chips, IC, semiconductor automation equipment
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [Shenzhen Tianwei Microelectronics](https://endata.com/companies/43992.md)

## Sources

- [semiunion.com](https://www.semiunion.com/park/052312162020.html), 2019-12-18: "广西天微芯片项目总投资5亿元，分二期完成，一期项目计划投资1亿元，并于2019月7月开工建设，目前已完成厂房装修，223台(套)设备正在安装调试，预计2019年12月底可正式投产。"

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Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.