# Winpac completes investment in flip chip and PoP production facilities

Winpac completed a 50 billion won investment in new factory and equipment in Yongin, South Korea, for flip chip and package-on-package semiconductor packaging, and began mass production.

- Type: Expansion
- Announced: 2019-10-28
- Where: Yongin, South Korea
- Value: $43.0M (50.0B KRW)
- Starts operating: 28 Oct 2019
- Status: completed
- Capacity: monthly sales capacity of 10 billion won
- Products: flip chip packaging, package-on-package packaging
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [Winpac](https://endata.com/companies/42930.md)

## Sources

- [etoday.co.kr](https://www.etoday.co.kr/news/view/1814622), 2019-10-28: "반도체 후공정 전문업체 윈팩이 플립칩(FliP chip)과 패키지 온 패키지(POP) 생산시설 투자를 완료하고 본격 양산에 들어간다고 28일 밝혔다."

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Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.