# TSMC, Bosch, Infineon, NXP break ground on chip fab in Dresden

TSMC, together with Bosch, Infineon, and NXP, held the groundbreaking ceremony for a new semiconductor fabrication plant (ESMC) in Dresden, Germany. The investment is approximately EUR 10 billion, making it the largest single corporate investment in Saxony since 1990.

- Type: New facility
- Announced: 2019-09-05
- Where: Dresden, Saxony, Germany
- Value: $11.0B (10.0B EUR)
- Status: under construction
- Products: semiconductor chips
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [TSMC](https://endata.com/companies/15886.md)
- [Bosch](https://endata.com/companies/1725.md) (partner)
- [Infineon](https://endata.com/companies/22833.md) (partner)
- [NXP](https://endata.com/companies/41913.md) (partner)

## Sources

- [medienservice.sachsen.de](https://www.medienservice.sachsen.de/medien/news/1078827), 2019-09-05: "Mit dem heutigen Spatenstich für das neue Halbleiterwerk hier in Dresden wird nicht nur der Grundstein für eine zukunftsweisende Technologie gelegt, sondern auch für eine nachhaltige wirtschaftliche Entwicklung in der Region."

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Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.