# JCET ramps 12-inch wafer bumping line in Incheon, South Korea

JCET moved into volume production with its new 12-inch wafer bumping line at its assembly and test facility in Incheon, South Korea. The line offers lead-free and copper column bump types.

- Type: Expansion
- Announced: 2019-07-29
- Where: Incheon, South Korea, South Korea
- Starts operating: 29 Jul 2019
- Status: completed
- Products: 12-inch wafer bumping, flip chip packaging
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [Jiangsu Changjiang Electronics Technology](https://endata.com/companies/36550.md)

## Sources

- [einpresswire.com](https://www.einpresswire.com/article/492044740/new-jcet-12-inch-wafer-bumping-line-in-advanced-flip-chip-south-korea-factory-ramps-into-high-volume), 2019-07-29: "We are proud to offer an additional source for bumping within the JCET group of factories."

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Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.