# Silan Microelectronics accelerates 12-inch chip fab in Xiamen

Silan Microelectronics is accelerating construction of a 12-inch specialty process chip manufacturing line and a compound semiconductor line in Xiamen, with trial production planned for Q4 2019 and 2020 respectively. Total investment is 22 billion yuan.

- Type: New facility
- Announced: 2019-07-18
- Where: Xiamen, Fujian, China
- Value: $3.20B (22.0B CNY)
- Starts operating: Q4 2019
- Status: under construction
- Capacity: 8万片/月 (80,000 wafers per month) for first 12-inch line; 4/6-inch compound line
- Products: 12-inch specialty process chips, compound semiconductor devices, power semiconductor chips, MEMS sensors, third-generation power semiconductors, optical communication devices, high-end LED chips
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [Silan Microelectronics](https://endata.com/companies/28894.md)

## Sources

- [21ic.com](https://www.21ic.com/news/mcu/201907/901968.htm), 2019-07-18: "士兰微电子决定加速推进在厦门的化合物半导体芯片及12英寸特色工艺半导体芯片制造生产线建设，并分别计划在今年第四季度和明年试投产。"

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Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.