# Tongfu Microelectronics expands Hefei IC packaging plant

Tongfu Microelectronics is expanding its Hefei Phase I project, which currently produces 17 million integrated circuits per day. The Phase I project invested 3.3 billion RMB, and Phase II is planned with an additional 2.7 billion RMB investment.

- Type: Expansion
- Announced: 2019-07-01
- Where: Hefei, China
- Value: $390.0M (2.70B CNY)
- Status: under construction
- Capacity: 11.5 billion integrated circuits per year (Phase I and II combined)
- Products: integrated circuits, lead frame packaging, advanced packaging wafer bumps
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [Tongfu Microelectronics Co., Ltd.](https://endata.com/companies/22832.md)

## Sources

- [xcc.com](https://www.xcc.com/news/detail/2025250), 2019-07-01: "目前一期项目每天的产能达到1700万颗集成电路，还在继续扩产。"

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Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.