# Ibiden plans record JPY 75.5 billion investment in package substrates

Ibiden plans to invest 75.5 billion yen in its electronics division (package substrates and printed wiring boards) in fiscal 2019, a record single-year amount, to increase production capacity for flip-chip package substrates.

- Type: Investment
- Announced: 2019-05-28
- Where: Ogaki, Gifu Prefecture, Japan, Japan
- Value: $690.0M (75.5B JPY)
- Starts operating: Q1 2020
- Status: announced
- Products: flip-chip package substrates, printed wiring boards
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [IBIDEN Co., Ltd.](https://endata.com/companies/23859.md)

## Sources

- [news.infoseek.co.jp](https://news.infoseek.co.jp/article/toushin1_11412/), 2019-05-28: "イビデンは2019年度（20年3月期）設備投資金額のうち、パッケージ基板やプリント配線板で構成される電子部門に755億円を計画、単年度としては過去最高の投資額となる見込みだ。"

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Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.