# Unimicron to invest NT$20 billion in IC substrate plant expansion

Unimicron (欣興) announced a plan to invest approximately NT$20 billion from 2019 to 2022 to expand its high-end IC flip-chip substrate plant, targeting 5G, AI, and data center technologies.

- Type: Investment
- Announced: 2019-05-09
- Where: TWN
- Value: $645.0M (20.0B TWD)
- Status: announced
- Products: IC flip-chip substrates
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [Unimicron](https://endata.com/companies/39428.md)

## Sources

- [cna.com.tw](https://www.cna.com.tw/news/afe/201905090380.aspx), 2019-05-09: "希望經由技術與商業併進的方式，與世界級公司協同合作，發展5G、AI和大數據中心時代所需的高階先進IC覆晶載板利基技術，提升公司競爭力。"

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Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.