# Magnachip and Hyundai Mobis conclude IGBT technology agreement

Magnachip Semiconductor has concluded an agreement with Hyundai Mobis regarding the use of high-performance IGBT technology, and plans to expand its industrial IGBT business based on this technology developed through a 10-year collaboration.

- Type: Partnership
- Announced: 2019-03-06
- Status: announced
- Products: IGBT technology, traction inverter IGBT
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md), [Automotive Components](https://endata.com/sectors/automotive-components.md)

## Companies

- [Hyundai Mobis](https://endata.com/companies/10831.md) (partner)
- [Magnachip Semiconductor](https://endata.com/companies/32126.md) (partner)

## Sources

- [markets.bostonherald.com](http://markets.bostonherald.com/bostonherald/article/bizwire-2025-11-3-magnachip-to-expand-its-industrial-igbt-business-based-on-advanced-traction-inverter-igbt-technology-jointly-developed-in-strategic-partnership-with-hyundai-mobis), 2019-03-06: "Magnachip today announced it has concluded an agreement with Hyundai Mobis Company Limited regarding the use of high-performance Insulated Gate Bipolar Transistor (IGBT) technology"

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Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.