# HD MicroSystems and American Semiconductor establish joint development agreement for ultra-thin chip packaging

HD MicroSystems (HDM) and American Semiconductor (ASI) announced a joint development agreement to drive adoption of ultra-thin chip packaging technology for rigid and flexible electronics markets, leveraging ASI's wafer-level chip scale packaging and HDM's polyimide materials.

- Type: Partnership
- Announced: 2019-02-15
- Where: Boise, Idaho, United States
- Status: announced
- Products: ultra-thin packaged ICs
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [HD MicroSystems](https://endata.com/companies/37371.md) (partner)
- [American Semiconductor](https://endata.com/companies/37372.md) (partner)

## Sources

- [americansemi.com](https://www.americansemi.com/hdm-and-asi-announce-jda-to-produce-the-worlds-first-high-reliability-ultra-thin-packaged-ics/), 2019-02-15: "HD MicroSystemsTM (HDM) and American Semiconductor, Inc. (ASI) today announced the establishment of a joint development agreement to drive the adoption of ultra-thin chip packaging technology for both traditional rigid and emerging flexible electronics markets."

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Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.