# Tongfu Microelectronics completes Phase 2 factory shell at Nantong base

Tongfu Microelectronics completed the exterior of its Phase 2 factory at the Nantong Sutong Industrial Park in Jiangsu, China. The Phase 2 project involves a total investment of 2 billion yuan ($297 million) and will apply advanced Fan-Out technology for high-end smart chip production. Interior construction is expected to be completed in the first half of 2019.

- Type: Expansion
- Announced: 2019-02-11
- Where: Nantong, Jiangsu, China
- Value: $297.0M (2.00B CNY)
- Starts operating: Q3 2019
- Status: under construction
- Products: advanced semiconductor packaging, Fan-Out packaging, smart chips
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [Tongfu Microelectronics Co., Ltd.](https://endata.com/companies/22832.md)

## Sources

- [kipost.net](https://www.kipost.net/news/articleView.html?idxno=200481), 2019-02-11: "2기 프로젝트는 앞서 2017년 11월 18일 기초 공사를 완료한 이래 올해 상반기 중 공장 내부 건설까지 완료할 예정이다."

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Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.