# Cree signs $250M SiC wafer supply deal with STMicroelectronics

Cree signed a multi-year agreement to supply $250 million of 150mm silicon carbide wafers to STMicroelectronics for automotive and industrial applications.

- Type: Contract
- Announced: 2019-01-07
- Where: United States
- Value: $250.0M
- Status: announced
- Products: silicon carbide wafers, epitaxial wafers
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [STMicroelectronics](https://endata.com/companies/21952.md) (customer)
- [Cree](https://endata.com/companies/23782.md) (supplier)

## Sources

- [wolfspeed.com](https://www.wolfspeed.com/company/news-events/news/cree-and-stmicroelectronics-announce-multi-year-silicon-carbide-wafer-supply-agreement/), 2019-01-07: "This is the third multi-year agreement that we have signed this past year in support of the industry's transition from silicon to silicon carbide."
- [eetimes.com](https://www.eetimes.com/cree-signs-250-million-deal-to-supply-st-with-sic-wafers/), 2019-01-10: "This agreement with Cree will improve our flexibility, sustain our ambition and plans, and contribute to boosting the pervasion of SiC in automotive and industrial applications."

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Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.