# UMC approves NT$27.41 billion budget for wafer capacity expansion

United Microelectronics Corp (UMC) approved a capital spending budget of NT$27.41 billion (US$887.6 million) to boost 12-inch and 8-inch wafer capacities in Taiwan, Singapore and Xiamen, China. The Xiamen fab will increase monthly capacity to 25,000 wafers, and the Hejian Technology fab in Suzhou to 75,000 wafers per month.

- Type: Investment
- Announced: 2018-12-12
- Where: Taiwan, Singapore, Xiamen (China), Suzhou (China), TWN
- Value: $887.6M (27.4B TWD)
- Status: announced
- Capacity: 12-inch Xiamen fab: 25,000 wafers per month; 8-inch Hejian fab: 75,000 wafers per month
- Products: 12-inch wafers, 8-inch wafers
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [United Microelectronics Corporation](https://endata.com/companies/19674.md)
- [United Semiconductor (Xiamen)](https://endata.com/companies/28443.md)
- [Hejian Technology (Suzhou) Co Ltd](https://endata.com/companies/36108.md)

## Sources

- [taipeitimes.com](https://www.taipeitimes.com/News/biz/archives/2018/12/13/2003706001), 2018-12-12: "The outlay is mostly for expanding capacities via debottlenecking [in the manufacturing process] and adding automation to fabs in Taiwan, Singapore and Xiamen of China."

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Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.