# Advanced Semiconductor Manufacturing signs wafer foundry agreement with Shanghai Belling

Advanced Semiconductor Manufacturing Corporation (ASMC) signed a new framework foundry agreement with Shanghai Belling to produce 5, 6, and 8-inch semiconductor wafers. The agreement runs from November 8, 2018 to November 7, 2019, with an annual cap of 34 million yuan.

- Type: Contract
- Announced: 2018-11-08
- Where: China
- Value: $4.90M (34.0M CNY)
- Status: completed
- Products: 5, 6, and 8-inch semiconductor wafers
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [Advanced Semiconductor Manufacturing Corporation](https://endata.com/companies/23742.md) (supplier)
- [Shanghai Belling](https://endata.com/companies/35245.md) (customer)

## Sources

- [zhitongcaijing.com](https://www.zhitongcaijing.com/content/detail/162541.html), 2018-11-08: "公司(作为供应商)与上海贝岭(作为买方)签订一份新框架代工协议，自2018年11月8日至2019年11月7日止，为期一年。"

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Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.