# Shinko Electric invests ¥1.6B in next-gen plastic BGA substrate line

Shinko Electric Industries will invest 1.6 billion yen in fiscal 2019 to build a next-generation plastic BGA substrate manufacturing line at its Arai Plant in Myoko, Niigata, Japan. The line will use advanced MSAP technology and is expected to start operation in the second half of fiscal 2019.

- Type: Investment
- Announced: 2018-10-26
- Where: Myoko, Niigata, Japan
- Value: $14.1M (1.60B JPY)
- Starts operating: Q4 2019
- Status: announced
- Products: plastic BGA substrates
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [Shinko Electric Industries](https://endata.com/companies/35146.md)

## Sources

- [nikkei.com](https://www.nikkei.com/article/DGXLRSP494177_W8A021C1000000/), 2018-10-26: "次世代プラスチックBGA基板の設備投資を実施することといたしました。"

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Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.