# Winbond breaks ground on NT$335B fab in Southern Taiwan Science Park

Winbond Electronics Corp broke ground on a NT$335 billion (US$10.92 billion) 12-inch fab in Southern Taiwan Science Park, Kaohsiung, to produce DRAM and flash memory chips, creating at least 2,500 jobs.

- Type: New facility
- Announced: 2018-10-03
- Where: Southern Taiwan Science Park, Kaohsiung, TWN
- Value: $10.9B (335.0B TWD)
- Jobs: 2,500
- Starts operating: 2020
- Status: under construction
- Capacity: 285,000 wafers per month
- Products: DRAM, flash memory chips
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [Winbond Electronics](https://endata.com/companies/26748.md)

## Sources

- [taipeitimes.com](https://www.taipeitimes.com/News/biz/archives/2018/10/03/2003701596), 2018-10-02: "The investment is the largest scale in the history of the park in Kaohsiung's Lujhu District, surpassing all capital that has been invested over the past 15 years."

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Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.