# Powertech breaks ground on $1.68B chip packaging plant in Taiwan

Powertech Technology broke ground on a new advanced chip packaging factory in Hsinchu, Taiwan, with an investment of more than NT$50 billion (US$1.68 billion). The plant targets AI, high-performance computing, and connected car applications.

- Type: New facility
- Announced: 2018-09-25
- Where: Hsinchu, TWN
- Value: $1.68B
- Status: under construction
- Products: advanced chip packaging
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [Powertech Technology](https://endata.com/companies/34511.md)

## Sources

- [asia.nikkei.com](https://asia.nikkei.com/business/companies/powertech-invests-1.7bn-in-taiwan-chip-packaging-plant), 2018-09-25: "Powertech on Tuesday broke ground on its new advanced chip packaging factory in the Taiwanese city of Hsinchu."

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Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.