# Bosch holds groundbreaking for 300mm fab in Dresden, Germany

Bosch held a groundbreaking ceremony for a new 300mm fab in Dresden, Germany on April 24, 2018. Equipment installation is expected in the second half of 2019.

- Type: New facility
- Announced: 2018-09-20
- Where: Dresden, Germany, Germany
- Starts operating: Q3 2019
- Status: under construction
- Products: semiconductor wafers (300mm)
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [Bosch](https://endata.com/companies/1725.md)

## Sources

- [semi.org](https://www.semi.org/en/blogs/business-markets/semi-fabview-update-more-investments-in-semiconductor-fabs), 2018-09-20: "Bosch 300mm fab in Dresden, Germany – Bosch held a groundbreaking ceremony on April 24."

---
Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.