# Winbond to invest NT$20.37B in new 12-inch fab in Kaohsiung

Winbond Electronics' board approved a plan to invest NT$20.37 billion (US$661 million) to build a 12-inch fab in Kaohsiung, Taiwan. Construction is to begin in Q4 2018 as part of a larger NT$335 billion capacity expansion scheme over 15 years.

- Type: New facility
- Announced: 2018-08-17
- Where: Kaohsiung, TWN
- Value: $661.0M (20.4B TWD)
- Status: announced
- Products: NOR flash memory chips, DRAM memory chips
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [Winbond Electronics](https://endata.com/companies/26748.md)

## Sources

- [taipeitimes.com](http://www.taipeitimes.com/News/biz/archives/2018/08/18/2003698701), 2018-08-17: "We are seeing demand from tier-one customers increasing faster for certain DRAM. That is one of the reasons that Winbond needs to build a new fab fast."

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Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.