# CanSemi Technology breaks ground on 300mm wafer fab in China

CanSemi Technology broke ground on a 300mm wafer fab in December 2017 with 7 billion yuan (about $1 billion) investment. The fab will make chips using 0.18-micron to 0.13-micron processes, with first wafers expected in 2019 and capacity of 40,000 wafer starts per month.

- Type: New facility
- Announced: 2017-12-26
- Where: China
- Value: $1.00B (7.00B CNY)
- Starts operating: 2019
- Status: under construction
- Capacity: 40,000 wafer starts per month
- Products: MCUs, PMICs, analog ICs, power discretes
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [CanSemi Technology](https://endata.com/companies/33661.md)

## Sources

- [eenewseurope.com](https://www.eenewseurope.com/en/idm-or-foundry-chinese-startup-announces-300mm-fab-build/), 2018-08-08: "CanSemi Technology Inc. broke ground on its 300mm wafer fab on December 26, 2017 and claims to have 7 billion yuan (about US$1 billion) of investment available."

---
Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.