# Winbond to build NT$355B 12-inch fab in Kaohsiung

Winbond Electronics announced it will start building a new 12-inch wafer fab in Kaohsiung in September 2018, with an investment of NT$355 billion (US$11.9 billion). Equipment installation is slated for 2020, with production ramp-up to follow.

- Type: New facility
- Announced: 2018-06-11
- Where: Kaohsiung, TWN
- Value: $11.9B (355.0B TWD)
- Starts operating: 2020
- Status: announced
- Products: memory chips, NOR flash, DRAM
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [Winbond Electronics](https://endata.com/companies/26748.md)

## Sources

- [taipeitimes.com](https://www.taipeitimes.com/News/biz/archives/2018/06/12/2003694717), 2018-06-11: "Winbond is to start building a new fab in September to cope with promising demand for memory chips used in Internet of Things (IoT) applications, cars and big data collection and analysis."

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Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.