# Teledyne selects onsemi's Treo platform for infrared imaging ASICs

onsemi announced that Teledyne Technologies has selected its Treo platform to develop next-generation readout integrated circuit (ROIC) ASICs for infrared imaging systems for aerospace, defense, security, and scientific applications.

- Type: Contract
- Announced: 2018-05-25
- Status: announced
- Products: readout integrated circuit ASICs, infrared imaging systems
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [onsemi](https://endata.com/companies/15223.md)
- [Teledyne Technologies](https://endata.com/companies/1748.md) (customer)

## Sources

- [business.sherbrookerecord.com](https://business.sherbrookerecord.com/sherbrookerecord/article/gnwcq-2025-10-28-onsemis-treo-platform-selected-by-teledyne-for-advanced-infrared-imaging-design), 2018-05-25: "onsemi today announced that Teledyne Technologies has selected its Treo platform to develop next-generation readout integrated circuit (ROIC) application-specific integrated circuits (ASICs) for infrared imaging systems."

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Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.